Equipment Applications & Process Functions

1. Designed for Laser De-flash operations in QFN and semiconductor packaging processes.

2. Automatically removes residual flash and adhesive around packaged ICs to ensure superior appearance quality and enhance downstream process reliability.

3. Supports AOI vision positioning, 1D/2D barcode reading, and high-precision CCD alignment.

4. Laser power, scanning paths, and processing parameters can be automatically controlled according to product recipes.

Automation & Material Handling Capabilities

1. Fully automatic loading and unloading system.

2. Automatic Magazine and Track Push-in / Push-out material transfer.

3. Equipped with vacuum suction platform, material jam detection, and re-pick protection mechanisms.

4. Loader and Unloader are designed on the same side to maximize production line layout flexibility.

5. Automatic return-to-magazine function prevents material mixing and ensures traceability.

Laser Processing Capabilities

1. Laser Model: KEYENCE MD-X2500 Series.

2. Laser Power Range: 5W ~ 25W.

3. Supports multi-level parameter settings, including laser energy, scanning speed, and focal distance.

4. Integrated laser dust and particle extraction system.

5. Supports One-by-One processing according to product POD instructions.